NVIDIA Jetson Orin Nano Super Dev-kit : MDS테크

: Entry-Level 엣지 AI 및 생성형 AI를 위한 새로운 패러다임

NVIDIA Jetson Orin Nano Super Developer Kit



  • 더 향상된 AI 성능

    • 25W의 전력 옵션으로
      최대 67TOPS AI 성능 및
      102GB/s 메모리 대역폭

  • 모든 생성형 AI 모델 지원

    • 비전 트랜스포머,
      Large Language Models
      Vision-Language Models 등 포함

생성형 AI를 위한 새로운 가능성

NVIDIA Jetson Orin™ Nano Super Dev-kit


  • Jetson Orin™ Nano Super Dev-kit

    • (Module + Heat Sink + Carrier board)

  • 802.11ac/abgn
    무선 네트워크 인터페이스 컨트롤러


  • DC 전원 어댑터 및 코드


  • 빠른 시작 및 지원 가이드

NVIDIA Jetson Orin™ Nano Super Dev-kit
AI Performance67 TOPS
GPU1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores
GPU Max Frequency1020 MHz
CPU6-core Arm® Cortex®-A78AE v8.2 64-bit CPU
1.5MB L2 + 4MB L3
CPU Max Frequency1.7 GHz
Memory8GB 128-bit LPDDR5
102 GB/s
Storage-
(SD Card Slot & external NVMe via M.2 Key M)
Video Encode1080p30 supported by 1-2 CPU cores
Video Decode1x 4K60 (H.265) 2x 4K30 (H.265) 5x 1080p60 (H.265) 11x 1080p30 (H.265)
CSI Camera2x MIPI CSI-2 22-pin Camera Connectors
PCIe*M.2 Key M slot with x4 PCIe Gen3 M.2 Key M slot with x2 PCIe Gen3 M.2 Key E slot
USB*USB Type-A Connector: 4x USB 3.2 Gen2 USB Type-C Connector for UFP
Networking*1xGbE Connector
Display1x DisplayPort 1.2 (+MST) connector
Other I/O40-Pin Expansion Header(UART, SPI, I2S, I2C, GPIO) 12-pin button header 4-pin fan header microSD Slot DC power jack
Power7W / 15W / 25W
Mechanical100 mm x 79 mmx 21 mm (Height includes feet, carrier board, module, and thermal solution)
REFERENCE CARRIER BOARD SPEC 바로가기
REFERENCE CARRIER BOARD SPEC
Camera2x MIPI CSI-2 22-pin Camera Connectors
M.2 Key Mx4 PCIe Gen 3
M.2 Key Mx2 PCIe Gen3
M.2 Key EPCIe (x1), USB 2.0, UART, I2S, and I2C
USBType A: 4x USB 3.2 Gen2
Type C: 1x for UFP
Networking1x Gbe Connector
DisplayDisplayPort 1.2 (+MST)
microSD slotUHS-1 cards up to SDR104 mode
Others40-Pin Expansion Header (UART, SPI, I2S, I2C, GPIO)
12-pin button header
4-pin fan header
DC power jack
Dimensions100 mm x 79 mmx 21 mm
(Height includes feet, carrier board, module, and thermal solution)
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